牛津OpAL開放式樣品載入ALD設(shè)備
緊湊型開放式樣品載入原子層沉積（ALD）系統(tǒng)
OpAL提供了專業(yè)的熱ALD設(shè)備，可以簡單明了的升***使用等離子體，使得在同***緊湊設(shè)備中集成了等離子體和熱ALD。
· 開放式樣品載入熱ALD，集成等離子體技術(shù)
· 現(xiàn)場升***到可使用等離子體
· 從小晶片到200mm大晶片
適用于學(xué)術(shù)、產(chǎn)業(yè)、研發(fā)的熱和/或等離子體化學(xué)產(chǎn)品，可用于：
氧化物： HfO2, Al2O3, TiO2, SiO2, ZnO, Ta2O5
氮化物：TiN, Si3N4
金屬： Ru, Pt
ALD應(yīng)用舉例：
· 納米電子學(xué)
· 高k柵極氧化物
· 存儲(chǔ)電容器絕緣層-銅連線間的高縱橫比擴(kuò)散勢壘區(qū)
· 有機(jī)發(fā)光二極管和聚合物的無針孔鈍化層
· 鈍化晶體硅太陽能電池
· 應(yīng)用于微流體和MEMS的高保形涂層
· 納米孔結(jié)構(gòu)的涂層
· 生物微機(jī)電系統(tǒng)
· 燃料電池
直觀性強(qiáng)的的軟件提高性能
使用與牛津儀器的值得信賴的Plasmalab ®產(chǎn)品***族相同的軟件平臺(tái)， OpAL的程序驅(qū)動(dòng)、多用戶***別、PC2000TM控制的軟件易于操作且可為快速ALD做相應(yīng)修改。
OpAL provides professional thermal ALD equipment that can be easily upgraded using plasma so that plasma ａnd thermal ALD are integrated in the same compact device.
· open sample loading ALD, integrated plasma technology
· upgrade the site to use plasma
· small to 200mm chips
Thermal and/or plasma chemical products suitable for academic, industrial, research ａnd development use:
Oxides: HfO2, Al2O3, TiO2, SiO2, ZnO, Ta2O5
Nitride: TiN, Si3N4
Metal: Ru, Pt
ALD application examples:
· nano electronics
· high k gate oxides
· high aspect ratio diffusion barrier area between storage capacitor insulation layer ａnd copper wire
· pinhole-free passivation layer for organic light-emitting diodes ａnd polymers
· passivated crystalline silicon solar cells
· high conformal coatings for microfluidics ａnd MEMS applications
· coating of nanopore structure
· biological micro-electromechanical system
· fuel cell
Intuitive software improves performance
Using the same software platform as Oxford instruments＇ trust-worthy Plasmalab ® family of products, OpAL＇s program-driven, multi-user level, PC2000TM controlled software is easy to operate ａnd can be modified for fast ALD.
滬公網(wǎng)安備31011502016460號(hào)
